BPA CALL
ActiveHQ072726FE068
Department of Defense › Defense Microelectronics Activity › DEFENSE MICROELECTRONICS ACTIVITY
$502K
obligated · signed 4 months ago
PCB FABRICATION AND ASSEMBLY OF MICROELECTRONIC COMPONENTS TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND PROCURE MICROELECTRONICS AND/OR OPERATE SUCH A FACILITY.
Performance timeline
Start
Jun 2, 2026
End
Dec 18, 2026
with all options
Loading status
This contract is likely in the recompete window
Ends with all options: Dec 18, 2026
AMERICAN COMPUTER DEVELOPMENT, INCORPORATED
Contract HQ072726FE068
UEI
WQNJUQYA25F9
Parent Company
AMERICAN COMPUTER DEVELOPMENT, INCORPORATED
Capabilities & Certifications
Headquarters Location
Congressional District: 06
Current Obligation
$501,952
Base + Exercised Options
$501,952
Total Ceiling Value
$501,952
Contract Type
FIRM FIXED PRICE
NAICS
PRINTED CIRCUIT ASSEMBLY (ELECTRONIC ASSEMBLY) MANUFACTURING
PSC
ELECTRICAL AND ELECTRONIC ASSEMBLIES, BOARDS, CARDS, AND ASSOCIATED HARDWARE
Place of Performance
Congressional District: 06
Awarding Agency
Top-tier agency
Defense Microelectronics Activity
Sub-tier agency
DEFENSE MICROELECTRONICS ACTIVITY
Office
Funding Agency
Top-tier agency
Defense Microelectronics Activity
Sub-tier agency
DEFENSE MICROELECTRONICS ACTIVITY
Office
Contract Vehicle
HQ072726AE002
BPADepartment of Defense
Award type: MULTIPLE AWARD
Solicitation procedures, competition exceptions, labor standards and account totals.