DELIVERY ORDER
ActiveHQ072726FE078
Department of Defense › Defense Microelectronics Activity › DEFENSE MICROELECTRONICS ACTIVITY
$5.8M
obligated · signed 3 months ago
THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO IDENTIFY, ACQUIRE, CHARACTERIZE, AND ANALYZE FOREIGN BATTLEFIELD THREAT TARGETS (FBTTS)
Performance timeline
Start
Jul 10, 2026
End
Jul 31, 2027
with all options
Loading status
This contract is likely in the recompete window
Ends with all options: Jul 31, 2027
LEIDOS, INC.
Contract HQ072726FE078
UEI
KTMAJCY6JXM3
Parent Company
LEIDOS HOLDINGS, INC.
Capabilities & Certifications
Headquarters Location
Congressional District: 11
Current Obligation
$5,793,416
Base + Exercised Options
$5,793,416
Total Ceiling Value
$5,793,416
Contract Type
COST PLUS FIXED FEE
Multi-Year Contract
NO
NAICS
ENGINEERING SERVICES
PSC
NATIONAL DEFENSE R&D SERVICES; DEPARTMENT OF DEFENSE - MILITARY; EXPERIMENTAL DEVELOPMENT
Place of Performance
Congressional District: 11
Awarding Agency
Top-tier agency
Defense Microelectronics Activity
Sub-tier agency
DEFENSE MICROELECTRONICS ACTIVITY
Office
Funding Agency
Top-tier agency
Department of the Army
Sub-tier agency
W6DV PEO M & S REDSTONE
Office
Contract Vehicle
HQ072726DE005
IDCDepartment of Defense
Award type: MULTIPLE AWARD
Solicitation procedures, competition exceptions, labor standards and account totals.