Request for Information (RFI) for Advancing Critical and Emerging Microelectronics Technologies I. Background Information The United States is in a battle for global leadership in the critical and emerging technologies that will drive decades of national and economic security and prosperity. To ensure U.S. global dominance in the industries of the future, we seek to advance the nation’s stated agenda to secure the U.S. position as the unrivaled world leader in emerging technology. As the nation’s premier laboratory with a mission to promote U.S. innovation and industrial competitiveness, Sandia National Laboratories (SNL) is poised to work with industry at every step to support U.S. manufacturing and technological capacity in critical and emerging microelectronics technologies. The basis for this RFI is aligned with the goal of advancing technology leadership in the United States and strengthening the supply chain for domestic semiconductor manufacturing. II. Opportunity Description and Areas of Interest The following are general topic areas that have been identified as priority areas for proposals under this RFI: 1. Semiconductors. Proposed projects may include conducting research and prototyping of advanced semiconductor technologies to strengthen the economic competitiveness and security of the domestic supply chain, overcome R&D ecosystem gaps, and develop innovative advanced technologies, including but not limited to: Microelectronic/Semiconductor Devices: Analog and Digital Signal Processing and Computing Technologies Includes neuromorphic, energy efficient artificial intelligence hardware, analog, digital and mixed signal processing, next generation memory technologies Power Electronics GaN/AlGaN/AlN, Diamond, SiC, and Ga2O3 Magnetic and dielectric materials (including integrated magnetics and dielectrics), Advanced Sensing and Timing Materials, devices, architectures, detectors, systems, read out integrated circuits, and atomic clocks Communications Technologies Radio frequency, optoelectronic/photonic, quantum Miroelectronics fabrication and characterization capability: Advanced test, assembly, and packaging capability in the domestic ecosystem. Heterogeneous integration and 3D packaging, chiplets, 3D stacking, novel memory architectures, 2.5D packaging, integrated photonic packages, ultrahigh density interposers, and next generation assembly and systems packaging. Materials characterization, instrumentation, and testing for next generation microelectronics. Virtualization and automation of maintenance of semiconductor machinery. Metrology for security and supply chain verification. Next generation design: design and system level co-optimization, AI-enabled devices through system designs, advanced design automation. Accelerating domestic manufacturing fabs: robotics, automation, digital twins, AI-enabled manufacturing, national security manufacturing, and securing critical supply chains. Advanced Packaging : high-power packaging and power modules (related to HI for high voltage/power. 2. Application of Artificial Intelligence (AI) for advanced microelectronics research and development. Proposed projects may include the development and adoption of AI-driven autonomous agents, AI-based agents for cybersecurity, and consistency in AI system performance measurement. General applications of AI technologies not directly related to advanced microelectronics research and development are not within the scope of this RFI. Example technical areas of interest for the demonstration of AI using semiconductors include, but are not limited to: Compute efficiency. Novel memory stacks. Cryogenic operations. AI at edge. Stacked machine health monitoring. AI devices for extreme environments. Using AI to accelerate domestic manufacturing fabs to secure critical supply chains. 3. Application of quantum technology for advanced microelectronics research and development. Proposed projects may include research and prototyping of advanced semiconductor technology for quantum technology, manufacturing of quantum sensors, scalable high-performance quantum components, and development of quantum networks. Example technical areas of interest for the demonstration of quantum technology using semiconductors include, but are not limited to: Scalable quantum computing. Quantum networks and communications. Quantum sensing and metrology. Accelerating domestic manufacturing fabs: scale domestic production of quantum hardware, domestic buildout of cryogenic, optical, and ultra-high vacuum manufacturing lines, national security manufacturing, secure critical supply chains. Photonics for quantum 4. Commercialization of innovations. Proposed projects may include the adoption and commercialization of federally funded scientific discoveries and technology advancements. Examples within commercialization of innovation using semiconductors include but are not limited to: Advanced testing Assembly Packaging capability that involve eligible participants, that may include Manufacturing USA Institute or other consortiums to adopt and commercialize innovations. III. Submission Guidelines and Points of Contact Response Format: Please submit your responses in a PDF or Word document format (5 page maximum.) Deadline for Submission : Applications will be accepted until September 30, 2029. Contact Information: For any questions or clarifications regarding this RFI, please contact Ken Dean (kadean@sandia.gov) and Lauren Kemme (lakemme@sandia.gov). IV. Evaluation Criteria Responses will be evaluated based on the following criteria: Relevance and completeness of the information provided Clarity and organization of the response Demonstrated understanding of the technical purpose and background Experience and qualifications of the respondent V. Additional Information Respondents are encouraged to provide any additional information that may be relevant to this RFI. This may include case studies, examples of previous work, or any other materials that demonstrate your capabilities and expertise.
