Call For Solutions- Advanced Manufacturing Components and OIB Technology Insertion

This Call for Solution is issued under the Army Open Solicitation W9128Z-25-S-A002. 

The Army Contracting Command – Redstone Arsenal, on behalf of the office of the US Army Aviation and Missile Command (AMCOM), is seeking innovative solutions for Advanced Manufacturing Components and OIB Technology Insertion.
 
The US Army recognizes the need for accelerated modernization of weapon systems through Advanced Manufacturing (AdvM) technologies that directly address issues and challenges in the supply chain to underpin readiness of Army materiel. The US Army also recognizes the need to transition AdvM technology to the Organic Industrial Base (OIB). The goal of this project is to support the design and qualification of aviation and missile AdvM parts through innovative tools, methodologies, qualification frameworks for the modernization and sustainment of Army aviation and missile components and assist with technology insertions at the OIB. The provided engineering and technical services shall span the full lifecycle of AdvM implementation to include candidate assessments, concept development, design maturation, material and process selection, analysis, prototyping, and supporting all testing, qualification, and certification requirements.
 
The Call for Solutions document, outlining the full problem statement, required solution attributes, submission requirements, and evaluation phases can be found in the "Attachments" section below.
 
The deadline to submit questions for Phase 1 is June 11th, 2026 at 12:00 PM Central Daylight Time (CDT).
 
The following shall be utilized in the email subject line: "Call for Solution – AdvM Components and OIB Technology Insertion / W9128Z-25-S-A002 (Question regarding section #)"
 
The Army Open Solicitation (AOS) that this Call for Solution is associated with can be found at: https://sam.gov/workspace/contract/opp/09ab570a35484c6cb5c6eba05cad19b3/view
 
Please review the AOS posting and associated attachments, in addition to the attachment to this call, for further information on how the AOS is structured.