Multichip Module Package for SiC Pressure Sensors

Description

** THIS IS A SOLE SOURCE REQUIREMENT ** for Multichip Module Package for SiC Pressure Sensors

Classifications

NAICS

334419

Other Electronic Component Manufacturing

31-33├Manufacturing

334├Computer and Electronic Product Manufacturing

3344├Semiconductor and Other Electronic Component Manufacturing

33441├Semiconductor and Other Electronic Component Manufacturing

334419└Other Electronic Component Manufacturing

PSC

6695

COMBINATION AND MISCELLANEOUS INSTRUMENTS

66├INSTRUMENTS AND LABORATORY EQPT

6695└Combination and Miscellaneous Instruments

Documents

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